深圳市易捷測(cè)試技術(shù)有限公司
深圳市易捷測(cè)試技術(shù)有限公司
電話:0755-83698930
郵箱:dongni.zhang@gbit.net.cn
地址:深圳市福田區(qū)福虹路9號(hào)世貿(mào)廣場(chǎng)C座1203室
精密倒裝芯片貼片機(jī) CB-610
探針臺(tái)|全自動(dòng)探針臺(tái)|硅光晶圓測(cè)試系統(tǒng)|半自動(dòng)探針臺(tái)|手動(dòng)探針臺(tái)|國(guó)產(chǎn)探針臺(tái)|Hanwa ESD/ TLP測(cè)試儀|CDM測(cè)試機(jī)|晶圓級(jí)ESD測(cè)試儀|芯片HCI/BTI/TDDB/DCEM可靠性測(cè)試設(shè)備、滿足實(shí)驗(yàn)室研發(fā)和晶圓廠量產(chǎn)的多種需求。廣泛應(yīng)用于:WAT/CP測(cè)試、I-V/C-V測(cè)試、RF/mmW測(cè)試、高壓/大電流測(cè)試、在片wlr、在片老化burning、高低溫測(cè)試、光電器件測(cè)試(硅光、CMOS,SPAD傳感器等)、晶圓級(jí)失效分析、芯片ESD測(cè)試、半導(dǎo)體工藝可靠性驗(yàn)證、封裝測(cè)試等領(lǐng)域
芯片倒裝鍵合機(jī)
特點(diǎn):
Correspond to fine pitch of electrodes with mounting accuracy ± 1μm
Correspond yo ultra-low load(0.049N)to high load (490N)without head replacement
follows thermal variation of work and tools in real time
Equipped with recipes for various bonding processes as standard
Feedback of abnormalities by bonding log analysis
Standard Items & Optional Items
<Standard Items>
Flip chip unit
Constant heat stage
ATC( Automatic ceramic tool change )
Calibration
Process management (logger / export to another PC)
Automatic leveling mechanism
<Optional Items>
Eutectic head ( No heating )
Eutectic purge jig
Eutectic stage(□52mm pulse heater
Transfer function( Flux, Paste)
Dispenser unit( except dispenser)
Die bonding
Chip imaging camera
Gel pack
Ultrasonic bonding
ID Reading
功能:貼片應(yīng)用:倒裝焊 |